- SPU: AL-NO46-7w5zr5e7[N3]
- Model: Solder Paste SolderPaste
- Brand:XG-50
- Processing and customization: No
- Viscosity:0.2
- Granularity:25-45
- Alloy composition: lead + tin
- Activity:99
- Type: canned
- Cleaning angle: around solder joints
- Melting point: 183℃
- Type: tin paste
- Working temperature: above 200
- Scope of application: mobile phone chip repair, computer or home appliance chip patch repair, BGA special products
- Specifications: XGSP30 (medium temperature 20g)
- Specifications: XGSP50 (medium temperature 42g)
- Specifications: XGSP80 (medium temperature 60g)
- Specifications: XGSP200 (medium temperature 200g)
- Specifications: XGSP500 (medium temperature 500g)
- Specifications:XG-50
- Specifications:XGSP40 (35g)
- Specifications:XG-30 (16g)
- Specifications:XG-Z40
After sales information
Within 15 days from the date of receipt, customers can be provided with an unconditional return service. The application for return of goods requires the consent of the merchant in the store.
Procurement and delivery
Delivery time: For products in stock, they will be shipped within 3 working days (excluding holidays) after you place your order and make payment. You will receive our notification after shipment.
payment
Credit card payment (quick payment) is a new payment method jointly launched by third-party payment platforms and major banks. It is one of the safest and easiest payment methods. Users do not need to activate online banking in advance, they can complete quick payments by entering information such as card face and mobile phone dynamic password. Quick payment allows various bank card users to conveniently make online payments without the need for special online banking activation.
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